Co-Packaged Optics (CPO, 共封装光学) integrates optical components and semiconductor chips (半导体芯片) into a single package (单一封装), reducing signal loss (信号损耗) and improving data transmission speed compared to traditional discrete optics (传统分立光学). This design shortens the physical distance between chips and optics, lowering latency (延迟) – a critical factor (关键因素) for high-performance computing (高性能计算, HPC) and data centers (数据中心). It also cuts power consumption (功耗), addressing the energy efficiency (能源效率) challenges of modern digital infrastructure (数字基础设施).
CPO is widely applied in large-scale data centers and AI computing clusters (AI计算集群), where massive data needs real-time processing and transmission. It supports next-generation 5G/6G networks and cloud computing, meeting the surging demand (激增的需求) for higher bandwidth (更高带宽). Additionally, it plays a key role in advanced industries like autonomous driving (自动驾驶) and quantum computing (量子计算), where stable, high-speed data links are essential.
The global CPO market is projected to grow rapidly in the next five years, driven by AI and cloud service expansion. Major tech firms are investing heavily in R&D, making CPO a core technology for global digital transformation. Its cost-effectiveness and performance advantages will further expand its application scope across industries.
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